*Scope covers from PACKAGING TO PCB papers relevant to the below scopes are encouraged to submit but NOT limited to.

Join us at IMPACT 2023 to be part of the future of electronics technology! This conference also collaborates with international organizations such as ICEP and JIEP from Japan, iNEMI and IEEE EPS from the USA, and global consulting companies like Yole Développement and Techsearch from the USA. To provide a valuable platform for these innovations, IMPACT 2023 will host plenary speeches, special sessions, industrial sessions, invited talks, outstanding papers, and poster presentations. The rapid development of HPC, AI, and Metaverse technologies will revolutionize existing technologies, connecting people in new ways and redefining our lives. The symposium will focus on the theme “ IMPACT on the future of HPC, AI, and Metaverse', exploring the latest electronic technologies and fostering collaboration among enterprises and organizations. 25th-27th at Taipei Nangang Exhibition Center in conjunction with TPCA Show 2023. IMPACT 2023 Conference, organized by IEEE-EPS-Taipei, iMAPS-Taiwan, ITRI, and TPCA, is the largest gathering of PCB and packaging professionals in Taiwan.

Authors can now submit their papers through the call for papers system!!

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